Polyimide (PI) ICP Etching

PI may be dry etched using Inductively Coupled Plasma (ICP) etch. The process is very clean and will only require very occasional plasma cleaning.

SEM image shows vertical 7µm deep polyimide structures etched by ICP using a metal mask.

  PlasmaPro 100 ICP180 PlasmaPro 100 ICP380
Etch rate: >1µm/min >1µm/min
Uniformity:    < ± 5% (7mm edge excl) < ± 5% (7mm edge excl)
Selectivity to Al, Cr, Ti: > 30:1 > 30:1
Selectivity to silylated PR: > 15:1 > 15:1
Wafer Size:   Up to 100mm Up to 200m


Polyimide (PI) ICP Etching for Failure Analysis

Polyimide (PI) ICP Etching for Failure Analysis

PI has applications can be used for Failure Analysis. It has excellent process repeatability and clean removal of a wide range of materials is possible, without lifting of metal tracks.

  PlasmaPro System133 ICP380
Etch rate: お問い合わせください
Uniformity: お問い合わせください
Selectivity to SiNx: お問い合わせください
Wafer size: お問い合わせください


アサイラム・リサーチのAFMが超高分解能の新基準を打ち立てました!AFMを溶液製膜法と組み合わせることにより、ポリマー構造の特性評価において、シンプルかつ超高分解能なアプローチを提供する事が可能に‼ 詳細は、”Nature”… https://t.co/Sv3gO79mpn
6:33 午前 - 19 4 19