Benzocyclobutene (BCB) Etching

BCB has applications in the fabrication of gallium arsenide integrated circuits, bumping and redistributing GaAs chips and for planarization and isolation in flat-panel displays. It may be dry etched using theInductively Coupled Plasma (ICP) process technique.

SEM image shows a via hole etched in BCB. Couresty of FhG IAF Freiburg
 

 

Process Specification

  PlasmaPro100 ICP180 PlasmaPro100 ICP380
Etch rate: お問い合わせ下さい お問い合わせ下さい
Uniformity: お問い合わせ下さい お問い合わせ下さい
Selectivity to PR: お問い合わせ下さい お問い合わせ下さい
Selectivity to oxide: お問い合わせ下さい お問い合わせ下さい
Selectivity to Al: お問い合わせ下さい お問い合わせ下さい
Wafer size: お問い合わせ下さい お問い合わせ下さい