Diamond Like Carbon (DLC) deposition
DLC deposited in the PlasmaPro System133 RIE features high breakdown voltage (example >1750V for a 120nm thick film), low leakage and high hardness. These properties make it a suitable passivation material for high voltage devices.
The PlasmaPro System133 RIE tool allows both deposition and etching of DLC films. Its large electrode size allows batch mode of operation. For maximum throughput and ease of use a cassette-loaded version is also available.
The PlasmaPro System133 RIE also uses optical emission to optimize the plasma clean or plasma etch time ensuring maximum throughput.
SEM image shows HR-TEM picture, 200kV, elastically filtered taken by TU Chemnitz, showing the interface of a 200nm amoprhous DLC film deposited on a
Si wafer at Oxford Instruments' application lab