Diamond Like Carbon (DLC) deposition

  • DLC deposited in the PlasmaPro System133 RIE features high breakdown voltage (example >1750V for a 120nm thick film), low leakage and high hardness. These properties make it a suitable passivation material for high voltage devices.
  • The PlasmaPro System133 RIE tool allows both deposition and etching of DLC films. Its large electrode size allows batch mode of operation. For maximum throughput and ease of use a cassette-loaded version is also available.
  • The PlasmaPro System133 RIE also uses optical emission to optimize the plasma clean or plasma etch time ensuring maximum throughput.

SEM image shows HR-TEM picture, 200kV, elastically filtered taken by TU Chemnitz, showing the interface of a 200nm amoprhous DLC film deposited on a
Si wafer at Oxford Instruments' application lab

Process Specification

  PlasmaPro System133 RIE
Deposition rate: お問い合わせください
Uniformity: お問い合わせください
Batch size: お問い合わせください

 

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